Rogers and FR4 Multilayer PCB Circuit Board Gold Plating Edge PCB Assembly Service Multilayer PCB Board

Rogers and FR4 Multilayer PCB Circuit Board Gold Plating Edge PCB Assembly Service

Specificaiton:

Our service are as following:

1. Offer service for PCB and PCBA design
2. Offer service for purchasing components according to your PCBA boom list
3. Producing PCB according to your gerber file
4. Offer SMT service for your PCBA
5. No limit quantity
6. Supplying of small volume production
7. Quick turn is available

• Product performance
• Prompt delivery
• Quality approvals
• Reputation
• Service
• Small orders accepted
• Brand-name parts
• Country of origin
• Distributorships offered
• Electronic link
• Experienced staff
• Form A
• Green product
• Guarantee/warranty
• Product features
• International approvals
• Military specifications
• Packing

What KAZ Circuit can do for you:

• PCB manufacturing (prototype, small to medium, mass production)
• Components Sourcing
• PCB Assembly/SMT/DIP

To get a full quotation of the PCB/PCBA, pls provide the information as below:

• Gerber File, with detail specification of the PCB
• BOM List (Better with excel fomart)
• Photoes of the PCBA (If you have done this PCBA before)

Multilayer PCB
    Multilayer PCB is a printed circuit board made of more than two layers of copper foil. It consists of an inner copper foil, an insulating substrate and an outer copper foil, and the interconnection between the layers is achieved by drilling and copper plating. Compared with single-layer or double-layer PCBs, multilayer PCBs can achieve higher wiring density and complex circuit design.

Advantages of multi-layer PCBs:

    Higher wiring density and complex circuit design capabilities
    Better electromagnetic compatibility and signal integrity
    Shorter signal transmission paths, improved circuit performance
    Higher reliability and mechanical strength
    More flexible power and ground distribution

Composition of multi-layer PCBs:

    Inner copper foil: Provides conductive layer and wiring
    Insulating substrate (FR-4, high-frequency low-loss dielectric, etc.): Isolates and supports each copper foil layer
    Outer copper foil: Provides surface wiring and interface
    Perforated metallization: Realizes electrical connection between layers
    Surface treatment: HASL, ENIG, OSP and other surface treatment processes

Design and manufacture of multi-layer PCBs:

    Circuit design: Signal integrity, power/ground integrity design of multi-layer boards
    Layout and wiring: Reasonable layer allocation and routing optimization
    Process design: Aperture size, layer spacing, copper foil thickness, etc.
    Manufacturing process: Lamination, drilling, copper plating, etching, surface treatment, etc.

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