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| Brand Name: | KAZ |
| Model Number: | PCB-B-002 |
| MOQ: | 1 |
| Price: | 0.1-3usd/pc |
| Payment Terms: | Paypal, T/T, Western Union |
| Supply Ability: | 10000-20000 square meters per month |
Multilayer Sided Printed Circuit Boards , Rigid Flex Circuit pcba Board Standard FR-4,Electronic Printed Circuit Board
Bried description
Our PCB technology capacity includes 1 to 50 layers, minimum dill hole size of 0.1mm, minimum track/line size of 0.075mm, surface treatment of OSP, HAL, HASL, ENIG, Gold Finger and more. We can make our production capacity of 10,000-20,000 square meters/month for double sides and 8,000-12,000square meters/month for multilayer.
We have over 300 employees and 8,000 square meters building area. Our products include Normal Tg FR4, High Tg FR4, PTFE, Rogers, Low Dk/Df, FPC, Rigid-Flex PCB and Aluminum, Copper base PCB, etc. Assembly service including SMT, DIP with six assembly lines.
Manufacturer Capacity:
| Capacity | Double Sided: 12000 sq.m / month Multilayers: 8000sq.m / month |
| Min Line Width/Gap | 4/4 mil (1mil=0.0254mm) |
| Board Thickness | 0.3~4.0mm |
| Layers | 1~20 layers |
| Material | FR-4, Aluminum, PI |
| Copper Thickness | 0.5~4oz |
| Material Tg | Tg140~Tg170 |
| Max PCB Size | 600*1200mm |
| Min Hole Size | 0.2mm (+/- 0.025) |
| Surface Treatment | HASL, ENIG, OSP |
Detailed specification
| Layer count | Single sided, double sided and multilayer to 50 layers. |
| Base material | FR-4, High Tg FR-4, Aluminum Base, Copper Base, CEM-1, CEM-3 and so on |
| Board thickness | 0.6-3mm or thinner |
| Copper thickness | 0.5-6oz or thicker |
| surface treatment | HASL, Immersion Gold(ENIG), Immersion Silver, Immersion Tin, Plating Gold and Gold finger. |
| Soldmask | Green, Blue, Black, Matte Green , White and Red |
| Silkscreen | Black and white |
What KAZ Circuit can do for you:
To get a full quotation of the PCB/PCBA, pls provide the information as below:
Electronic printed circuit board (PCB) manufacturing processes:
PCB material choice:
Common base materials include FR-4 (fiberglass), polyimide and ceramics
Consider properties such as dielectric constant, thermal performance, and flexibility
Special materials available for high-frequency, high-power or flexible PCBs
Copper thickness and layer count:
Typical copper foil thickness ranges from 1oz to 4oz (35µm to 140µm)
Single-sided, double-sided and multilayer PCBs available
Additional copper layers improve power distribution, heat dissipation and signal integrity
Surface Treatment:
HASL (Hot Air Solder Leveling) - Affordable, but surface may not be flat
ENIG (Electroless Nickel Immersion Gold) – provides excellent solderability and corrosion resistance
Immersion Silver - Cost effective for lead-free soldering
Additional options include ENEPIG, OSP and direct gold plating
Advanced PCB Technologies:
Blind and Buried Vias for High Density Interconnects
Microvia Technology for Ultra-Fine Pitch and Miniaturization
Rigid-flex PCBs for applications that require flexibility
High frequencies and high speeds with controlled impedance pc
PCB manufacturing technology:
Subtractive process (most common) - etching away unwanted copper
Additive process - creating copper traces on the base material
Semi-additive process - combining subtractive and additive technologies
Design for Manufacturer (DFM):
Adherence to PCB design guidelines for reliable manufacturing
Considerations include trace width/spacing, via size and component location
Close collaboration between designers and manufacturers is essential
QA and testing:
Electrical testing (e.g., online testing, functional testing)
Mechanical testing (e.g., bending, shock, vibration)
Environmental testing (e.g., temperature, humidity, thermal cycles)
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