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| Brand Name: | KAZpcb |
| Model Number: | PCB-B-010 |
| MOQ: | 1 |
| Price: | 0.1-3usd/pc |
| Payment Terms: | Paypal/, T/T, Western Union |
| Supply Ability: | 10000-20000 square meters per month |
OEM Mobile phone Blue Soldermask White Silkscreen FR4 Electronic Printed Circuit Board
Detail specification about Mobilephone Blue Soldermask White Silkscreen FR4 Electronic Printed Circuit Board
| Categary | PCB |
| Layers | 2L |
| Material | FR-4 |
| Copper thickness | 1/1OZ |
| Board thickness | 1.6mm |
| Soldermask | Blue |
| Quality standard | IPC Class 2, 100% E-testing |
| Certificates | TS16949, ISO9001, UL, RoHS |
Brief introduction about Shenzhen KAZ Circuit Co,. Ltd.
Brief introduction
Shenzhen KAZ Circuit Co., Ltd, found in 2007, is a PCB and PCBA custom-made manufacturer. It's commitment to high precision single, double-sided, multilayer printed circuit board and metal substrate circuit board production,which is a hightech enterprises including amnufacture, sales, service and so on.
We are confident to provide you quality products with factory-directed price within the fastest delivery time!
What KAZ Circuit can do for you:
To get a full quotation of the PCB/PCBA, pls provide the information as below:
Company Informaiton:
KAZ Circuit is a professional PCB manufacturer from China since 2007, also provide PCB Assembly service for our customers. Now with about 300 employees. Certified with ISO9001,TS16949, UL, RoHS. We are confident to provide you quality products with factory-directed price within the fastest delivery time!
Manufacturer Capacity:
| Capacity | Double Sided: 12000 sq.m / month Multilayers: 8000sq.m / month |
| Min Line Width/Gap | 4/4 mil (1mil=0.0254mm) |
| Board Thickness | 0.3~4.0mm |
| Layers | 1~20 layers |
| Material | FR-4, Aluminum, PI |
| Copper Thickness | 0.5~4oz |
| Material Tg | Tg140~Tg170 |
| Max PCB Size | 600*1200mm |
| Min Hole Size | 0.2mm (+/- 0.025) |
| Surface Treatment | HASL, ENIG, OSP |
Electronic printed circuit board (PCB) manufacturing processes:
PCB material choice:
Common base materials include FR-4 (fiberglass), polyimide and ceramics
Consider properties such as dielectric constant, thermal performance, and flexibility
Special materials available for high-frequency, high-power or flexible PCBs
Copper thickness and layer count:
Typical copper foil thickness ranges from 1oz to 4oz (35µm to 140µm)
Single-sided, double-sided and multilayer PCBs available
Additional copper layers improve power distribution, heat dissipation and signal integrity
Surface Treatment:
HASL (Hot Air Solder Leveling) - Affordable, but surface may not be flat
ENIG (Electroless Nickel Immersion Gold) – provides excellent solderability and corrosion resistance
Immersion Silver - Cost effective for lead-free soldering
Additional options include ENEPIG, OSP and direct gold plating
Advanced PCB Technologies:
Blind and Buried Vias for High Density Interconnects
Microvia Technology for Ultra-Fine Pitch and Miniaturization
Rigid-flex PCBs for applications that require flexibility
High frequencies and high speeds with controlled impedance pc
PCB manufacturing technology:
Subtractive process (most common) - etching away unwanted copper
Additive process - creating copper traces on the base material
Semi-additive process - combining subtractive and additive technologies
Design for Manufacturer (DFM):
Adherence to PCB design guidelines for reliable manufacturing
Considerations include trace width/spacing, via size and component location
Close collaboration between designers and manufacturers is essential
QA and testing:
Electrical testing (e.g., online testing, functional testing)
Mechanical testing (e.g., bending, shock, vibration)
Environmental testing (e.g., temperature, humidity, thermal cycles)
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