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Multilayer PCB Board
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Multilayer PCB Circuit Board 4 Layers FR-4 Tg150 1.0mm ENIG 1U" PCB Assembly Service Multilayer PCB Board

Multilayer PCB Circuit Board 4 Layers FR-4 Tg150 1.0mm ENIG 1U" PCB Assembly Service Multilayer PCB Board

Brand Name: KAZ
Model Number: PCB-B-369424
MOQ: 1
Price: 200
Supply Ability: 20000 sq.m / month
Detail Information
Place of Origin:
China
Certification:
ISO9001, UL, RoHS
Layers:
4
Material:
FR4 Tg150
Board Thickness:
1.0mm
Copper:
1/H/H/1 Oz
Surface:
ENIG 1u"
Size:
112.5*202mm / 25 UP
Packaging Details:
vacuum
Supply Ability:
20000 sq.m / month
Highlight:

custom printed circuit board

,

rigid flex pcb

Product Description

Multilayer PCB Circuit Board 4 Layers FR-4 Tg150 1.0mm ENIG 1U" PCB Assembly Service

 

 

    This is a 4 layers FR-4 Tg150 1.0mm 1/H/H/1 oz copper ENIG 1u" multilayer PCB circuit board, detail specification as below, with IPC Class 2 quality standard, panel size is 112.5*202mm .

  • 4 layers
  • FR-4 Tg150
  • ENIG 1u"
  • 1.0mm board thickness
  • 1/H/H/1 oz.
  • Green soldmask
  • White silkscreen
  • IPC Class 2

 

Manufacturing Capacity - Rigid PCB

 

Item Production Capacity
Type of Products Single Sided, double sided & multilayer
Max Board Size Single & Double Sided: 600*1500mm
Multilayer: 600*1,200 mm
Surface Finish HASL, ENIG, OSP, Immersion Silver, Golden Finger, etc.
Layers 1~20
Boad Thickness 0.4~4.0mm
Base Copper 18um(1/2oz), 35um (1oz), 70um (2oz), 105um (3oz), 150um (4oz), 300um (8oz)
Board Material FR-4, Aluminum base, Polymide, copper base, ceramic base
Min Drilling Hole Size 0.1mm
Min Line Width & Space 0.075mm
Platting Gold Nickle Plating Thickness 2.5~5um, gold thickness 0.05~0.1um
Tin Spraying Tin thickness 2.5~5um
Milling Space wire & edge: 0.15mm, hole & edge: 0.2mm, Contour Tolerance: +/-0.1mm
Socket Chamfer Angle: 30°/45°/60° Depth: 1~3mm
V-Cut Angle: 30°/45°/60° Depth: 1/3 of board thickness, min aise: 80*80mm
On-Off Test Max Testing Area: 400*1,200mm
Max Testing Point: 12,000 points
Max Testing Voltage: 300V
Max Insulation Resistance: 100mΩ
Impedance Control Tolerance ± 10%
Soldering Endurance 85℃~105℃ / 280℃~360℃
 

   

    PCB size: 112.5*202mm / 25 UP

    IPC Class 2 quality standard.

 

What KAZ Circuit can do for you:

  • PCB manufacturing (prototype, small to medium, mass production)
  • Components Sourcing
  • PCB Assembly/SMT/DIP


To get a full quotation of the PCB/PCBA, pls provide the information as below:

  • Gerber File, with detail specification of the PCB
  • BOM List (Better with excel fomart)
  • Photoes of the PCBA (If you have done this PCBA before)


Company Informaiton:


    KAZ Circuit is a professional PCB manufacturer from China since 2007, also provide PCB Assembly service for our customers. Now with about 300 employees. Certified with ISO9001,TS16949, UL, RoHS. We are confident to provide you quality products with factory-directed price within the fastest delivery time!

 


Manufacturer Capacity:

 

Capacity Double Sided: 12000 sq.m / month
Multilayers: 8000sq.m / month
Min Line Width/Gap 4/4 mil (1mil=0.0254mm)
Board Thickness 0.3~4.0mm
Layers 1~20 layers
Material FR-4, Aluminum, PI
Copper Thickness 0.5~4oz
Material Tg Tg140~Tg170
Max PCB Size 600*1200mm
Min Hole Size 0.2mm (+/- 0.025)
Surface Treatment HASL, ENIG, OSP

 

 

Multilayer PCB

    Multilayer PCB is a printed circuit board made of more than two layers of copper foil. It consists of an inner copper foil, an insulating substrate and an outer copper foil, and the interconnection between the layers is achieved by drilling and copper plating. Compared with single-layer or double-layer PCBs, multilayer PCBs can achieve higher wiring density and complex circuit design.

 

Advantages of multi-layer PCBs:

    Higher wiring density and complex circuit design capabilities

    Better electromagnetic compatibility and signal integrity

    Shorter signal transmission paths, improved circuit performance

    Higher reliability and mechanical strength

    More flexible power and ground distribution

 

Composition of multi-layer PCBs:

    Inner copper foil: Provides conductive layer and wiring

    Insulating substrate (FR-4, high-frequency low-loss dielectric, etc.): Isolates and supports each copper foil layer

    Outer copper foil: Provides surface wiring and interface

    Perforated metallization: Realizes electrical connection between layers

    Surface treatment: HASL, ENIG, OSP and other surface treatment processes

 

Design and manufacture of multi-layer PCBs:

    Circuit design: Signal integrity, power/ground integrity design of multi-layer boards

    Layout and wiring: Reasonable layer allocation and routing optimization

    Process design: Aperture size, layer spacing, copper foil thickness, etc.

    Manufacturing process: Lamination, drilling, copper plating, etching, surface treatment, etc.

 

 

More photoes for this 4 layers FR-4 Tg150 1.0mm 1/H/H/1 oz copper ENIG 1u" multilayer PCB

Multilayer PCB Circuit Board 4 Layers FR-4 Tg150 1.0mm ENIG 1U"  PCB Assembly Service Multilayer PCB Board 0

Multilayer PCB Circuit Board 4 Layers FR-4 Tg150 1.0mm ENIG 1U"  PCB Assembly Service Multilayer PCB Board 1

Multilayer PCB Circuit Board 4 Layers FR-4 Tg150 1.0mm ENIG 1U"  PCB Assembly Service Multilayer PCB Board 2

Multilayer PCB Circuit Board 4 Layers FR-4 Tg150 1.0mm ENIG 1U"  PCB Assembly Service Multilayer PCB Board 3

 

 

KAZ Company information
 

Manufacturing Equipments - Rigid PCB

 

Multilayer PCB Circuit Board 4 Layers FR-4 Tg150 1.0mm ENIG 1U"  PCB Assembly Service Multilayer PCB Board 4

 

Product Applicances

 

Multilayer PCB Circuit Board 4 Layers FR-4 Tg150 1.0mm ENIG 1U"  PCB Assembly Service Multilayer PCB Board 5

 

Product Show - Rigid PCB

 

Multilayer PCB Circuit Board 4 Layers FR-4 Tg150 1.0mm ENIG 1U"  PCB Assembly Service Multilayer PCB Board 6