|
| Brand Name: | KAZD |
| Model Number: | KAZ-B-003D |
| MOQ: | 1PC |
| Price: | 0.1-3usd/pc |
| Payment Terms: | T/T, Western Union,paypal |
| Supply Ability: | 20000 squaremetres/month |
OEM 4 Layers Electronic Printed Circuit Boards FR4 Material ENIG 1u' Gold Finger Solder Mask.OEM brand and3Mile
Features of Electronic Printed Board
1. One Stop OEM Service: Made in Shenzhen of China
2. Manufactured by Gerber File and Bom LIst Offered by Customers
3. SMT, DIP Technology Support
4. FR4 Material Meet 94v0 Standard
5. UL,CE,ROHS Compliant
6. Standard Lead Time: 4-5days for 2L;5-7 for 4L. Expedited Service is available
Detailed Specification
| Material | FR4 |
| Finish Board Thickness | 1.6MM |
| Finsh Copper Thickness | 1 OZ |
| Layer | 4 |
| Solder Mask Color | GREEN |
| Silkscreen | WHITE |
| Surface Treatment | ENIG |
| Finished Size | CUSTOMIZED |
What KAZ Circuit can do for you:
To get a full quotation of the PCB/PCBA, pls provide the information as below:
Company Informaiton:
KAZ Circuit is a professional PCB manufacturer from China since 2007, also provide PCB Assembly service for our customers. Now with about 300 employees. Certified with ISO9001,TS16949, UL, RoHS. We are confident to provide you quality products with factory-directed price within the fastest delivery time!
Manufacturer Capacity:
| Capacity | Double Sided: 12000 sq.m / month Multilayers: 8000sq.m / month |
| Min Line Width/Gap | 4/4 mil (1mil=0.0254mm) |
| Board Thickness | 0.3~4.0mm |
| Layers | 1~20 layers |
| Material | FR-4, Aluminum, PI |
| Copper Thickness | 0.5~4oz |
| Material Tg | Tg140~Tg170 |
| Max PCB Size | 600*1200mm |
| Min Hole Size | 0.2mm (+/- 0.025) |
| Surface Treatment | HASL, ENIG, OSP |
Electronic printed circuit board (PCB) manufacturing processes:
PCB material choice:
Common base materials include FR-4 (fiberglass), polyimide and ceramics
Consider properties such as dielectric constant, thermal performance, and flexibility
Special materials available for high-frequency, high-power or flexible PCBs
Copper thickness and layer count:
Typical copper foil thickness ranges from 1oz to 4oz (35µm to 140µm)
Single-sided, double-sided and multilayer PCBs available
Additional copper layers improve power distribution, heat dissipation and signal integrity
Surface Treatment:
HASL (Hot Air Solder Leveling) - Affordable, but surface may not be flat
ENIG (Electroless Nickel Immersion Gold) – provides excellent solderability and corrosion resistance
Immersion Silver - Cost effective for lead-free soldering
Additional options include ENEPIG, OSP and direct gold plating
Advanced PCB Technologies:
Blind and Buried Vias for High Density Interconnects
Microvia Technology for Ultra-Fine Pitch and Miniaturization
Rigid-flex PCBs for applications that require flexibility
High frequencies and high speeds with controlled impedance pc
PCB manufacturing technology:
Subtractive process (most common) - etching away unwanted copper
Additive process - creating copper traces on the base material
Semi-additive process - combining subtractive and additive technologies
Design for Manufacturer (DFM):
Adherence to PCB design guidelines for reliable manufacturing
Considerations include trace width/spacing, via size and component location
Close collaboration between designers and manufacturers is essential
QA and testing:
Electrical testing (e.g., online testing, functional testing)
Mechanical testing (e.g., bending, shock, vibration)
Environmental testing (e.g., temperature, humidity, thermal cycles)
Pictures
